Positioning apparatus and gripping apparatus

ABSTRACT

A gripping apparatus includes: a temperature adjusting device held in a substrate wherein the substrate defines an open region; a phase change material held within the open region and thermally coupled with the temperature adjusting device such that a temperature change in the temperature adjusting device causes a temperature change in the phase change material; and a controller connected to the temperature adjusting device and configured to send a signal to the temperature adjusting device to change its temperature and thereby change the temperature of the phase change material that is thermally coupled with the temperature adjusting device. The phase change material is either in a solid state and configured to grip a stick or in a liquid state and the phase change material and configured to loosen its grip on the stick such that the stick is capable of moving through the phase change material.

CROSS REFERENCE TO RELATED APPLICATION

This application claims the benefit of U.S. Application No. 62/718,251,filed Aug. 13, 2018 and titled POSITIONING APPARATUS AND GRIPPINGAPPARATUS, which is incorporated herein by reference in its entirety.

TECHNICAL FIELD

This disclosure relates to a gripping apparatus configured to control agrip on and a motion of a stick and a positioning apparatus in which thegripping apparatus can be used.

BACKGROUND

Probes can be used to research animal tissue, for example, forneurophysiological research or for clinical diagnostic uses in animals.For example, a movable single channel or single electrode mechanism canrecord from a single location (such as a visual cortex) in the brain ofan animal.

SUMMARY

In some general aspects, a gripping apparatus includes: a temperatureadjusting device held in a substrate wherein the substrate defines anopen region; a phase change material held within the open region andthermally coupled with the temperature adjusting device such that atemperature change in the temperature adjusting device causes atemperature change in the phase change material; and a controllerconnected to the temperature adjusting device and configured to send asignal to the temperature adjusting device to change its temperature andthereby change the temperature of the phase change material that isthermally coupled with the temperature adjusting device. When the phasechange material is at a temperature below a first transitiontemperature, the phase change material is in a solid state and the phasechange material is configured to grip a stick within the phase changematerial. When the phase change material is at a temperature above asecond transition temperature, the phase change material is in a liquidstate and the phase change material is configured to loosen its grip onthe stick such that the stick is capable of moving through the phasechange material.

Implementations can include one or more of the following features. Forexample, the stick can extend through the phase change material.

The phase change material can include one or more of: wax; paraffin wax;and alkane hydrocarbon. The alkane hydrocarbon can include one or moreof: n-octacosane, n-heptacosane, n-hexacosane, n-pentacosane,n-tetracosane, n-docosane, n-tricosane, n-heneicosane, n-eicosane,n-nonadecane, n-octadecane, n-heptadecane, n-hexadecane, n-pentadecane,n-tetradecane, and n-tridecane. The phase change material can beselected so that the transition between the solid state and the liquidstate at the first or second transition temperature occurs at anoperating temperature for the gripping apparatus.

The stick can be rigid enough to withstand motion through the phasechange material without fracturing or bending or kinking.

The first transition temperature and the second transition temperaturecan be at room temperature, at a temperature of a living organism, at atemperature below room temperature, or at a temperature above roomtemperature.

The stick can include one or more of: at least one conductor; at leastone measurement probe; at least one capillary tube; at least one opticalwaveguide; and at least one carbon fiber; and at least one sonicwaveguide. The at least one measurement probe can include an electricaltesting probe, a silicon probe, an electrical recording probe, or anultrasonic probe.

The substrate can generally be defined in an x-y plane, and when thephase change material can be at a temperature above the secondtransition temperature, the stick being capable of moving through thephase change material along a z axis that is perpendicular to the x-yplane.

A cross section of the stick taken along a plane can be a circularshape, a polygonal shape, or an irregular asymmetric shape.

The temperature adjusting device can include a resistive conductive wireand the controller can include a power source that supplies a current tothe resistive conductive wire, wherein the resistive conductive wirechanges its temperature as the current is changed. The temperatureadjusting device can include one or more of: a resistive materialdeposited in the open region of the substrate; a chip resistor adjacentto the open region of the substrate; a wire-wound resistor in the openregion of the substrate; and a carbon paste coated in the open region ofthe substrate.

The substrate can include a printed circuit board.

The phase change material can be held within the open region by way ofcapillary forces. The phase change material can remain within the openregion even if it is in the liquid state.

The first transition temperature can be equal to the second transitiontemperature.

In other general aspects, a positioning apparatus includes: an actuatordrive movable along an axial direction; a first gripping apparatus fixedto the actuator drive, the first gripping apparatus including a firstphase change material that is configured to receive a first region of astick; a second gripping apparatus fixed to the actuator drive, thesecond gripping apparatus including a second phase change material thatis aligned along an axial direction with the first phase change materialand that is configured to receive a second region of the stick; and acontroller connected to the first gripping apparatus, the secondgripping apparatus, and to the actuator drive. The controller isconfigured to provide one or more signals to the actuator drive, thefirst gripping apparatus, and the second gripping apparatus. The one ormore signals provided to the first gripping apparatus control a phase ofthe first phase change material and the one or more signals provided tothe second gripping apparatus control a phase of the second phase changematerial. A position of the stick along the axial direction is adjustedor held constant depending on the one or more signals provided to theactuator drive, the first gripping apparatus, and the second grippingapparatus.

Implementations can include one or more of the following features. Forexample, the actuator drive can have a first end and a second end. Thefirst and second ends can be movable relative to each other. The firstgripping apparatus can be fixed to the first end of the actuator drive.The second gripping apparatus can be fixed to the second end of theactuator drive.

The actuator drive can include one or more of: a turnable screwconfigured to turn about the axial direction to thereby translate thesecond end relative to the first end along the axial direction; astepper motor configured to move the second end relative to the firstend along the axial direction; a shape memory alloy configured to expandor contract to thereby adjust a relative position between the first endand the second end; and a piezoelectric actuator configured to move thesecond end relative to the first end along the axial direction.

The first end of the actuator drive can be fixed and the second end ofthe actuator drive can be movable relative to the first end of theactuator drive.

The actuator drive can be movable along only the axial direction undercontrol of the controller. The first gripping apparatus can furtherinclude: a first temperature adjusting device held in a first rigidsubstrate, the first rigid substrate defining a first open region andbeing fixed to the actuator drive to thereby fix the first grippingapparatus to the actuator drive. The first phase change material can beheld within the first open region and can be thermally coupled with thefirst temperature adjusting device such that a temperature change in thefirst temperature adjusting device causes a temperature change in thefirst phase change material. The controller can be connected to thefirst temperature adjusting device of the first gripping apparatus suchthat the provision of the signal to the first gripping apparatuscontrols a temperature of the first temperature adjusting device tothereby control a temperature of the first phase change material. Thesecond gripping apparatus can further include: a second temperatureadjusting device held in a second rigid substrate, the second rigidsubstrate defining a second open region and being fixed to the actuatordrive to thereby fix the second gripping apparatus to the actuatordrive. The second phase change material can be held within the secondopen region and can be thermally coupled with the second temperatureadjusting device such that a temperature change in the secondtemperature adjusting device causes a temperature change in the secondphase change material. The controller can be connected to the secondtemperature adjusting device of the second gripping apparatus such thatthe provision of the signal to the second gripping apparatus controls atemperature of the second temperature adjusting device to therebycontrol a temperature of the second phase change material.

The controller can include: a first control module connected to thefirst gripping apparatus; a second control module connected to thesecond gripping apparatus; and an actuator module connected to theactuator drive. The first control module can control a phase of thefirst phase change material, the first phase change material beingeither in a solid phase state in which the first phase change materialgrips the stick or a liquid phase state in which the first phase changematerial loosens its grip on the stick such that the stick is capable ofmoving through the first phase change material along the axialdirection. The second control module can control a phase of the secondphase change material, wherein the second phase change material iseither in a solid phase state in which the second phase change materialgrips the stick or a liquid phase state in which the second phase changematerial loosens its grip on the stick such that the stick is capable ofmoving through the second phase change material along the axialdirection. The actuator module can control the relative position betweena first end of the actuator drive and a second end of the actuator drivealong the axial direction.

The actuator module can provide a temporally-varying signal to theactuator drive; and a position of the stick along the axial directioncan be adjusted by adjusting the one or more signals provided to thefirst gripping apparatus and to the second gripping apparatus. Theposition of the stick along the axial direction can be adjusted withoutadjusting a signal provided to the actuator drive.

The controller can further include a master control module connected tothe first control module, the second control module, and the actuatormodule. The master control module can control the signals provided toeach of the first control module, the second control module, and theactuator module.

The second gripping apparatus can be thermally independent of the firstgripping apparatus.

In other general aspects, a positioning apparatus includes: a singleactuator drive movable along an axial direction; a plurality of axialholders, each axial holder configured to receive a stick and each axialholder being fixed to the single actuator drive; and a controller incommunication with the single actuator drive and with the plurality ofaxial holders. The controller is configured to: provide an actuationsignal to the single actuator drive; and provide at least oneindependent signal to each of the axial holders. The position of eachstick is independently adjustable along the axial direction by theadjustment of the provided at least one independent signal to each ofthe axial holders without adjusting the provided actuation signal to thesingle actuator drive.

Implementations can include one or more of the following features. Thesingle actuator drive can include a first end and a second end; and thefirst and second ends can be movable relative to each other along theaxial direction. Each axial holder can include a first grippingapparatus fixed to the first end of the single actuator drive and asecond gripping apparatus fixed to the second end of the single actuatordrive. The second gripping apparatus can be aligned along an axialdirection with the first gripping apparatus. For each axial holder: thefirst gripping apparatus can be configured to receive a first region ofthe stick that is received in that axial holder and the second grippingapparatus can be configured to receive a second region of the stick thatis received in that axial holder. For each axial holder: the firstgripping apparatus can include a phase change material that isconfigured to receive the first region of the stick that is received inthat axial holder; and the second gripping apparatus can include a phasechange material that is configured to receive the second region of thestick that is received in that axial holder.

The actuation signal can be provided to the single actuator drive byproviding a temporally-varying signal to the single actuator drive, thetemporally-varying signal controlling an axial position associated withthe single actuator drive.

Each axial holder can be configured to interact with at least twointeraction regions of its associated stick. At each interaction region,the stick can be received in a gripping apparatus. At least oneindependent signal can be provided to each of the axial holders byproviding an independent signal to each gripping apparatus in each axialholder. Each gripping apparatus can include a temperature adjustingdevice; and a phase change material thermally coupled with thetemperature adjusting device such that a temperature change in thetemperature adjusting device causes a temperature change in the phasechange material. The independent signal can be provided to a grippingapparatus by providing an independent signal to the temperatureadjusting device, and the state of the phase change material can beselected by adjustment of the provided independent signal to thetemperature adjusting device thermally coupled with the phase changematerial.

In other general aspects, a method includes: providing a singleactuation signal to a single actuator drive, wherein the singleactuation signal controls a movement of the single actuator drive alongan axial direction; providing an independent signal to each axial holderof a plurality of axial holders, wherein each axial holder receives astick and each axial holder is fixed to the single actuator drive; andindependently adjusting a position of a stick along the axial directionby adjusting the provided independent signal to the axial holder thatreceives that stick and without adjusting the provided actuation signalto the single actuator drive.

Implementations can include one or more of the following features. Forexample, the single actuation signal can be provided to the singleactuator drive by controlling a relative movement between a first end ofthe single actuator drive and a second end of the single actuator drivealong the axial direction. The single actuation signal can be providedto the single actuator drive by providing a temporally-varying signal tothe single actuator drive, the temporally-varying signal controlling anaxial position associated with the single actuator drive.

An independent signal can be provided to an axial holder by providing anindependent signal to a gripping apparatus in that axial holder. Theindependent signal can be provided to a gripping apparatus by providingan independent signal to a temperature adjusting device of the grippingapparatus. The method can further include selecting a state of a phasechange material thermally coupled to the temperature adjusting device byadjusting the provided independent signal to the temperature adjustingdevice thermally coupled with that phase change material.

In some general aspects, a method includes providing a single actuationsignal to a single actuator drive, wherein the single actuation signalcontrols a movement of the single actuator drive along an axialdirection; providing an independent signal to each axial holder of aplurality of axial holders, wherein each axial holder receives a stickand each axial holder is fixed to the single actuator drive; andindependently adjusting a position of a stick along the axial directionby adjusting the provided independent signal to the axial holder thatreceives that stick and without adjusting the provided actuation signalto the single actuator drive.

The single actuation signal can be provided to the single actuator driveby controlling a relative movement between a first end of the singleactuator drive and a second end of the single actuator drive along theaxial direction. The single actuation signal can be provided to thesingle actuator drive by providing a temporally-varying signal to thesingle actuator drive, the temporally-varying signal controlling anaxial position associated with the single actuator drive.

An independent signal can be provided to an axial holder by providing anindependent signal to a gripping apparatus of that axial holder. Theindependent signal can be provided to a gripping apparatus by providingan independent signal to a temperature adjusting device of the grippingapparatus. Moreover, the method can include selecting a state of a phasechange material thermally coupled to the temperature adjusting device byadjusting the provided independent signal to the temperature adjustingdevice thermally coupled with that phase change material.

DESCRIPTION OF DRAWINGS

FIG. 1 is a schematic perspective view of a gripping apparatusconfigured to control a grip on and a motion of a stick;

FIG. 2A is a side cross-sectional view of an implementation of thegripping apparatus of FIG. 1, in which the stick is gripped;

FIG. 2B is a top cross-sectional view of the implementation of thegripping apparatus of FIG. 1, in which the stick is gripped;

FIG. 3A is a side cross-sectional view of an implementation of thegripping apparatus of FIG. 1, in which the stick is released;

FIG. 3B is a top cross-sectional view of the implementation of thegripping apparatus of FIG. 1, in which the stick is released;

FIG. 4A is a side cross-sectional view and FIG. 4B is a topcross-sectional view of an implementation of a temperature adjustingdevice of a gripping apparatus;

FIG. 5A is a side cross-sectional view and FIG. 5B is a topcross-sectional view of an implementation of a temperature adjustingdevice of a gripping apparatus;

FIG. 6A is a side cross-sectional view and FIG. 6B is a topcross-sectional view of an implementation of a temperature adjustingdevice of a gripping apparatus;

FIGS. 7A-7E show side cross-sectional view of an implementation of stepsof a procedure for manufacturing a gripping apparatus such as thegripping apparatus of FIG. 1;

FIG. 8 is a schematic perspective view of a positioning apparatusincluding the gripping apparatus of FIG. 1 and configured to control agrip on and a motion of a stick;

FIG. 9 is a block diagram of an implementation of a controller of thepositioning apparatus of FIG. 8;

FIG. 10A shows side cross-sectional views of the positioning apparatusof FIG. 8 at distinct times in an exemplary signal cycle during whichaspects of the positioning apparatus are adjusted to thereby affect amovement of a stick along a −z direction of a z axis;

FIG. 10B shows a timing diagram of three signal amplitudes versus timethat correlates with each of the times depicted in FIG. 10A;

FIG. 11A shows side cross-sectional views of the positioning apparatusof FIG. 8 at distinct times in an exemplary signal cycle during whichaspects of the positioning apparatus are adjusted to thereby affect amovement of a stick along a +z direction of a z axis;

FIG. 11B shows a timing diagram of three signal amplitudes versus timethat correlates with each of the times depicted in FIG. 11A;

FIG. 12A shows side cross-sectional views of the positioning apparatusof FIG. 8 at distinct times in an exemplary signal cycle during whichaspects of the positioning apparatus are adjusted but a stick remainsstationary;

FIG. 12B shows a timing diagram of three signal amplitudes versus timethat correlates with each of the times depicted in FIG. 12A;

FIG. 13 is a block diagram of an implementation of a positioningapparatus designed to independently translate each of a plurality ofsticks along an axial direction of that stick using an actuator drive;

FIG. 14 is a perspective view of an implementation of the positioningapparatus of FIG. 13;

FIG. 15 is a partial side cross-sectional view of the implementation ofthe positioning apparatus of FIG. 14;

FIGS. 16A-16E a block diagrams, each showing an implementation of aconfiguration of sticks in the positioning apparatus of FIG. 13;

FIGS. 17A-17D show top plan views of an implementation of a positioningapparatus such as the positioning apparatus shown in FIGS. 13-15, withsteps in manufacturing depicted;

FIGS. 18A, 18B, and 18D show perspective views of an implementation of apositioning apparatus such as the positioning apparatus of FIGS. 13-15;

FIGS. 18C and 18E show an implementation of the sticks of thepositioning apparatus of FIGS. 13-15;

FIG. 19A shows a schematic representation of an implementation of apositioning apparatus of FIGS. 13-15; and

FIG. 19B shows a close-up view of an area of a substrate of thepositioning apparatus of FIG. 19A in which each temperature adjustingdevice is a chip resistor.

DETAILED DESCRIPTION

Referring to FIG. 1, a gripping apparatus 100 is designed to control agrip on and also a motion of a stick 105. The sizes and geometry offeatures and elements in FIG. 1 are exaggerated to show details. Thestick 105 can be any structure, device, or apparatus that generallyextends along an axial direction 110. The stick 105 can be a solidstructure or a hollow structure or a more complex structure made up ofmore than one material or region. In some implementations, the stick 105can be used to measure one or more properties of some other element. Inother implementations, the stick 105 can be used as an actuator toeffect or modify one or more characteristics of another element. Forexample, the stick 105 can include an electrical conductor (such as acable or wire); a measurement probe; a capillary tube; an opticalwaveguide; an optical fiber; a carbon fiber or filament; or a sonicwaveguide. If the stick 105 is a measurement probe, then it couldinclude an electrical testing probe, a silicon probe, an electricalrecording probe, or an ultrasonic probe.

The stick 105 can be made of any material that is capable ofwithstanding motion without fracturing or bending or kinking. Thus, thestick 105 has a level of rigidity that enables it to be gripped as wellas released and moved. A cross section of the stick 105 taken along aplane that is perpendicular to the axial direction 110 can have anygeometric shape and it may or may not have symmetry. For example, thecross section can be a circular shape, a polygonal shape, an oval shape,or an irregular asymmetric shape.

The gripping apparatus 100 includes a temperature adjusting device 115held or fixed in a substrate 120, and a phase change material 125. Thesubstrate 120 defines an open region 122 that is large enough toaccommodate the phase change material 125 as well as the stick 105 andany other components that may be used during assembly or manufacturing.The phase change material 125 is thermally coupled to the temperatureadjusting device 115. This means that a temperature change in thetemperature adjusting device 115 causes a temperature change in thephase change material 125. The stick 105 extends through the phasechange material 125.

The gripping apparatus 100 also includes a controller 130. Thecontroller 130 is connected to the temperature adjusting device 115 andis configured to send a signal to the temperature adjusting device 115to change its temperature. The change in temperature affected at thetemperature adjusting device 115 causes the temperature of the phasechange material 125 that is thermally coupled with the temperatureadjusting device 115 to change as well.

The phase change material 125 is a material that is able to transitionbetween two distinct phases of matter as a result of a change intemperature. For example, the phase change material 125 can transitionbetween a solid state and a liquid state. In some implementations, thephase change material 125 includes wax; paraffin wax; or alkanehydrocarbon. The alkane hydrocarbon can be any one or more of:n-octacosane, n-heptacosane, n-hexacosane, n-pentacosane, n-tetracosane,n-docosane, n-tricosane, n-heneicosane, n-eicosane, n-nonadecane,n-octadecane, n-heptadecane, n-hexadecane, n-pentadecane, n-tetradecane,and n-tridecane.

When in a liquid state, the phase change material 125 is held within theopen region 122 by way of capillary action (and without the assistanceof or in opposition to other external forces such as gravity). Thishappens because the adhesive forces, that is, the intermolecularattractive forces between the phase change material 125 and the solidsurrounding surface of one or more of the temperature adjusting device115 and the substrate 120, are stronger than the cohesive forces withinthe phase change material 125. If the size of the open region 122 (forexample, a diameter taken in the plane perpendicular to the axialdirection 110) is sufficiently small, then the combination of surfacetension (which is caused by cohesion within the liquid) and adhesiveforces act together to keep the phase change material 125 in the openregion 122. In this way, the phase change material 125 remains withinthe open region 122 even if it is in the liquid state. The amount ofphase change material 125 that is held within the open region 122 can beadjusted during assembly so that any expansion of the phase changematerial 125 during changes in phase is maintained within the openregion 122. Thus, even if the phase change material 125 expands with achange in temperature, it can still remain contained in the open region122. Additionally, in some implementations, the material of the phasechange material 125 is not chemically reactive or attracted to thematerial of the stick 105.

The substrate 120 is generally defined in a plane that is perpendicularto the axial direction 110. For example, if the axial direction 110 isdefined as the z axis, then the substrate 120 extends along the x-yplane. The substrate 120 also has a thickness along the z axis. In someimplementations, the substrate 120 includes a printed circuit board. Insuch implementations, as discussed below, the communication channel(which can be an electrical connection) between the temperatureadjusting device 115 and the controller 130 can be formed in the printedcircuit board.

The controller 130 can include one or more of digital electroniccircuitry, computer hardware, firmware, software, and a power supply.The controller 130 includes memory, which can be read-only memory and/orrandom-access memory. Storage devices suitable for tangibly embodyingcomputer program instructions and data include all forms of non-volatilememory, including, by way of example, semiconductor memory devices, suchas EPROM, EEPROM, and flash memory devices; magnetic disks such asinternal hard disks and removable disks; magneto-optical disks; andCD-ROM disks. The controller 130 can also include one or more inputdevices (such as a keyboard, touch screen, microphone, mouse, hand-heldinput device, etc.) and one or more output devices (such as a speaker ora monitor).

The controller 130 includes one or more programmable processors, and oneor more computer program products tangibly embodied in amachine-readable storage device for execution by a programmableprocessor. The one or more programmable processors can each execute aprogram of instructions to perform desired functions by operating oninput data and generating appropriate output. Generally, the processorreceives instructions and data from memory. Any of the foregoing may besupplemented by, or incorporated in, specially designed ASICs(application-specific integrated circuits). The controller 130 includesat least one module that includes a set of computer program productsexecuted by one or more processors such as the processors. Moreover, themodule can access data stored within the memory. The module can be incommunication with a dedicated other component of the gripping apparatus100 (for example, the temperature adjusting device 115).

Although the controller 130 is represented as a box (in which all of itscomponents can be co-located), it is possible for the controller 130 tobe made up of components that are physically remote from each other. Ingeneral, the controller 130 can perform functions not discussed herein.

The change of phase in the phase change material 125 is discussed withreference to FIGS. 2A-3B. In FIGS. 2A and 2B, the stick 105 is gripped,which means that it is fixed relative to the gripping apparatus 100 andis therefore prevented from moving relative to the gripping apparatus100. By contrast, in FIGS. 3A and 3B, the stick 105 is released, whichmeans that the stick 105 is capable of moving relative to the grippingapparatus 100. For example, the stick 105 is capable of moving along theaxial direction 110.

When the phase change material 125 is at a temperature below a firsttransition temperature T1 (FIGS. 2A and 2B), the phase change material125 is in a solid state. In this state, the phase change material 125grips the stick 105 that is within the phase change material 125. Thefirst transition temperature T1 is defined as that temperature at whichthe phase change material 125 is fully in the solid state afterpreviously being in the liquid state.

When the phase change material 125 is at a temperature above a secondtransition temperature T2 (FIGS. 3A and 3B), the phase change material125 is in a liquid state. In this state, the phase change material 125loosens its grip on the stick 105 such that the stick 105 is capable ofmoving through the phase change material 125. The second transitiontemperature T2 is defined as that temperature at which the phase changematerial 125 is fully in the liquid state after previously being in thesolid state.

Moreover, the transition between the solid state and the liquid state atthe first transition temperature T1 or the second transition temperatureT2 occurs at an operating temperature suitable for the grippingapparatus 100.

When the phase change material 125 is at a temperature above the secondtransition temperature T2, the stick 105 is capable of moving throughthe phase change material 125 along the z axis that is perpendicular tothe x-y plane.

In some implementations, depending on the application of the stick 105,the first transition temperature T1 and the second transitiontemperature T2 can be at or near room temperature (for example, 20-25°C.). In other implementations, the first transition temperature T1 andthe second transition temperature T2 can be at or near at a temperatureof a living organism (for example, 36-43° C.). In other implementations,the first transition temperature T1 and the second transitiontemperature T2 can be below room temperature, or above room temperature.

The first transition temperature T1 can be equal to the secondtransition temperature T2. However, because of hysteresis, it ispossible and likely that the transition temperatures T1 and T2 are notequal. The actual transition temperatures T1 and T2 depends on theprevious state of the gripping apparatus 100. For example, the firsttransition temperature T1 is less than the second transition temperatureT2. Additionally, as discussed above, the first transition temperatureT1 is defined as that temperature at which the phase change material 125is fully in the solid state after previously being in the liquid state.It is possible that the phase change material 125 remains in a fullysolid state at a temperature above the first transition temperature T1if the phase change material 125 is transitioning from a fully solidstate to a liquid state. Similarly, it is possible that the phase changematerial 125 remains in a fully liquid state at a temperature below thesecond transition temperature T2 if the phase change material 125 istransitioning from a fully liquid state to a solid state.

Additionally, there may exist intermediate phases within the range oftemperatures between the first transition temperature T1 and the secondtransition temperature T2 for some phase change materials 125.

The temperature adjusting device 115 is a device that is configured tochange its temperature and enable heat transfer between the temperatureadjusting device 115 and the phase change material 125. Moreover, thetemperature adjusting device 115 is configured to be held in place inthe substrate 120. In some implementations, the temperature of thetemperature adjusting device 115 is modified or changed by a change incurrent that is applied to the temperature adjusting device 115. Thus,the temperature adjusting device 115 can include an element that is ableto conduct current but has a high enough resistance to enable itstemperature to change by a suitable amount with a change in current.

Referring to FIGS. 4A-6B, various implementations of the temperatureadjusting device 115 are shown that are based on this resistivetemperature control. The stick 105 is not shown in FIGS. 4A-6B but wouldbe placed in and received in the open region 122.

In FIGS. 4A and 4B, the temperature adjusting device 115 is a resistivematerial 415 that is formed in or deposited in the open region 122. Theresistive material 415 can be any metal that is conductive and hasenough resistance to enable temperature adjustment. The resistivematerial 415 is formed so that it bonds to the interior surface of thesubstrate 120 that defines the open region 122. In some implementations,the resistive material 415 can be a carbon paste that coats the interiorsurface of the substrate 120 that defines the open region 122.

In FIGS. 5A and 5B, the temperature adjusting device 115 is a chipresistor 515 embedded within the open region 122 that receives the phasechange material 125. In this way, the chip resistor 515 is in thermalcommunication with the phase change material 125.

In FIGS. 6A and 6B, the temperature adjusting device 115 is a resistiveconductive wire 615 that is wound into a spiral shape inside the openregion 122 of the substrate 120. The wire 615 can be made of a metalalloy such as nichrome, which is an alloy of nickel and chrome.

In these implementations, the controller 130 includes a power sourcethat supplies a current to the resistive element (such as the resistivematerial 415, the chip resistor 515, or the conductive wire 615) by wayof electrically conductive elements 116, 117 (such as contacts orleads).

Referring to FIGS. 7A-7E, the gripping apparatus 100 is formed asfollows. As shown in FIG. 7A, the substrate 120 is selected. Asdiscussed above, the substrate 120 can be a blank region of a printedcircuit board, and the printed circuit board can include otherstructures or regions not shown in FIGS. 7A-7E. Moreover, while notshown in FIGS. 7A-7E, it is possible for these other structures orregions of the printed circuit board to have different or specializedthermal properties. As shown in FIG. 7B, the open region 122 is formedin the substrate 120. The open region 122 can be formed by drilling ahole into the substrate 120 or using a milling machine or any suitabledevice for removing the material of the substrate 120. As shown in FIG.7C, the temperature adjusting device 115 is formed so that it is held orfixed in the substrate 120. For example, the temperature adjustingdevice 115 can be held or fixed in the substrate 120 by gluing, epoxy,or embedding. The temperature adjusting device 115 can be formed in theopen region 122 or adjacent to the open region 122, as long as it islocated to be in thermal communication with the phase change material125. If the temperature adjusting device 115 is the resistive conductivewire 615, then it can be wound inside the open region 122 touching thesubstrate 120. If the temperature adjusting device 115 is the resistivematerial 415 then it can be painted on, deposited on, plated on, orsoldered into the open region 122, touching the substrate 120. If thetemperature adjusting device 115 is the chip resistor 515, then it canbe snapped or embedded into an opening such as the open region 122 andfixed into place by connection with the conductive elements 116, 117.

As shown in FIG. 7D, the phase change material 125 is deposited in theopen region 122 so that it is in thermal communication with thetemperature adjusting device 115. One way to deposit the phase changematerial 125 is to melt the phase change material 125 so that it is in aliquid state. The liquid form of the phase change material 125 can bedrawn up or into the open region 122 using capillary forces or action ina wicking process. Once the phase change material 125 is fully depositedinto the open region 122, as while the phase change material 125 isstill in its liquid state, the stick 105 is inserted into the phasechange material 125 and electrical connections are made between thetemperature adjusting device 115 and the controller 130.

The gripping apparatus 100 can be formed in a manner that is differentfrom that described with reference to FIGS. 7A-7E. For example, in otherimplementations, the phase change material 125 is added after the stick105 is inserted into or through the open region 122.

Referring to FIG. 8, the gripping apparatus 100 can be used in apositioning apparatus 840 that is designed to move a stick 805 along anaxial direction 810, which is parallel with the z axis. The stick 805 isshown for reference in FIG. 8 but is not necessarily a part of thepositioning apparatus 840. The positioning apparatus 840 includes anactuator drive 842 movable along the axial direction 810. In someimplementations, the actuator drive 842 can movable along only the axialdirection 810.

The positioning apparatus 840 includes a first gripping apparatus 800Afixed to the actuator drive 842, a second gripping apparatus 800B fixedto the actuator drive 842, and a controller 845. The controller 845 isin communication with the first gripping apparatus 800A, the secondgripping apparatus 800B, and the actuator drive 842 and thus thecontroller 845 controls the operation of each of the first grippingapparatus 800A, the second gripping apparatus 800B, and the actuatordrive 842. Communication between the controller 845 and other elementsof the positioning apparatus 840 can be wired or wireless.

The first and second gripping apparatuses 800A, 800B are designed likethe gripping apparatus 100. Thus, the first gripping apparatus 800Aincludes a first phase change material 825A that is configured toreceive a first region 805_1 of the stick 805. And, the second grippingapparatus 800B includes a second phase change material 825B that isaligned along the axial direction 810 with the first phase changematerial 825A and that is configured to receive a second region 805_2 ofthe stick 805.

The controller 845 is configured to provide one or more signals to theactuator drive 842, the first gripping apparatus 800A, and the secondgripping apparatus 800B. In order to facilitate communications, thepositioning apparatus 840 can include a sub-controller 830A incommunication with the first gripping apparatus 800A, a sub-controller830B in communication with the second gripping apparatus 800B, and asub-controller 831 in communication with the actuator drive 842. Anycommunication between the controller 845 and the actuator drive 842 isconveyed by the sub-controller 831; any communication between thecontroller 845 and the first gripping apparatus 800A is conveyed by thesub-controller 830A; and any communication between the controller 845and the second gripping apparatus 800B is conveyed by the sub-controller830B.

The one or more signals provided to the first gripping apparatus 800Acontrol a phase of the first phase change material 825A, and the one ormore signals provided to the second gripping apparatus 800B control aphase of the second phase change material 825B. In this way, a positionof the stick 805 along the axial direction 810 is adjusted or heldconstant depending on the one or more signals provided to the actuatordrive 842, the first gripping apparatus 800A, and the second grippingapparatus 800B, as discussed in greater detail below. The controller 845can be configured to adjust or control a timing and synchronizationbetween the changes in the actuator drive 842 and the changes in thefirst and second phase change materials 825A, 825B.

The actuator drive 842 has a first end 842_1 and a second end 842_2. Thefirst end 842_1 and the second end 842_2 are movable relative to eachother. Thus, for example, the second end 842_2 can move while the firstend 842_1 remains stationary in the x, y, z coordinate system, the firstend 842_1 can move while the second end 842_2 remains stationary in thex, y, z coordinate system, or both the first end 842_1 and the secondend 842_2 can move in the x, y, z coordinate system. If the firstgripping apparatus 800A is fixed to the first end 842_1 of the actuatordrive 842 and the second gripping apparatus 800B is fixed to the secondend 842_2 of the actuator drive 842, then the relative movement betweenthe first and second gripping apparatuses 800A, 800B can be controlled.

The actuator drive 842 can be any suitable drive that permits a relativemotion between the first end 842_1 and the second end 842_2. Thus, theactuator drive 842 can be configured to perform one or more of thefollowing controls: moving both the first end 842_1 and the second end842_2 relative to each other; moving the first end 842_1 and maintainingthe second end 842_2 stationary; and maintaining the first end 842_1stationary and moving the second end 842_2.

In some implementations, the actuator drive 842 is a turnable screwconfigured to turn about the axial direction 810 to thereby translatethe second end 842_2 relative to the first end 842_1 along the axialdirection 810. In other implementations, the actuator drive 842 is astepper motor configured to move the second end 842_2 relative to thefirst end 842_1 along the axial direction 810.

In other implementations, the actuator drive 842 is a piezoelectricactuator configured to move the second end 842_2 relative to the firstend 842_1 along the axial direction 810. The voltage level applied tothe piezoelectric material in the actuator is adjusted to thereby adjusta relative displacement between the first end 842_1 and the second end842_2.

In still other implementations, the actuator drive 842 includes a shapememory alloy that is configured to expand when heated, which causes thesecond end 842_2 and the first end 842_1 to move farther apart, and tocontract when cooled, which causes the second end 842_2 and the firstend 842_1 to move closer together. An example of a shape memory alloy isnitinol, which is an alloy of nickel and titanium.

As mentioned, the first gripping apparatus 800A and the second grippingapparatus 800B can be designed like the gripping apparatus 100. Thus,the first gripping apparatus 800A includes a first temperature adjustingdevice 815A held in a first rigid substrate 820A. The first rigidsubstrate 820A defining a first open region that receives the firsttemperature adjusting device 815A. The first rigid substrate 820A isfixed to the actuator drive 842 to thereby fix the first grippingapparatus 800A to the actuator drive 842. The first phase changematerial 825A is held within the first open region and is thermallycoupled with the first temperature adjusting device 815A such that atemperature change in the first temperature adjusting device 815A (whichis affected under control of the controller 845) causes a temperaturechange in the first phase change material 825A. The controller 845 is incommunication with the first temperature adjusting device 815A of thefirst gripping apparatus 800A such that the provision of the signal tothe first gripping apparatus 800A from the sub-controller 830A controlsthe temperature of the first temperature adjusting device 815A tothereby control a temperature of the first phase change material 825A.

The second gripping apparatus 800B further includes a second temperatureadjusting device 815B held in a second rigid substrate 820B, the secondrigid substrate defining a second open region and being fixed to theactuator drive 842 to thereby fix the second gripping apparatus 800B tothe actuator drive 842. The second phase change material 825B is heldwithin the second open region and is thermally coupled with the secondtemperature adjusting device 815B such that a temperature change in thesecond temperature adjusting device 815B causes a temperature change inthe second phase change material 825B. The controller 845 is incommunication with the second temperature adjusting device 815B of thesecond gripping apparatus 800B such that the provision of the signal tothe second gripping apparatus 800B from the sub-controller 830B controlsthe temperature of the second temperature adjusting device 815B tothereby control a temperature of the second phase change material 825B.

Referring also to FIG. 9, in some implementations, the controller 845includes a first control module 946 in communication with the firstgripping apparatus 800A by way of the sub-controller 830A, a secondcontrol module 947 in communication with the second gripping apparatus800B by way of the sub-controller 830B, and an actuator module 948 incommunication with the actuator drive 842 by way of the sub-controller831. The controller 845 can also include a master module 949 that is incommunication with one or more of the first control module 946, thesecond control module 947, and the actuator module 948.

In general, the controller 845 includes one or more of digitalelectronic circuitry, computer hardware, firmware, and software. Thecontroller 845 includes memory 950, which can be read-only memory and/orrandom-access memory. Storage devices suitable for tangibly embodyingcomputer program instructions and data include all forms of non-volatilememory, including, by way of example, semiconductor memory devices, suchas EPROM, EEPROM, and flash memory devices; magnetic disks such asinternal hard disks and removable disks; magneto-optical disks; andCD-ROM disks. The controller 845 can also include one or more inputdevices (such as a keyboard, touch screen, microphone, mouse, hand-heldinput device, etc.) and one or more output devices (such as a speaker ora monitor) 951.

The controller 845 includes one or more programmable processors 952, andone or more computer program products tangibly embodied in amachine-readable storage device for execution by a programmableprocessor. The one or more programmable processors can each execute aprogram of instructions to perform desired functions by operating oninput data and generating appropriate output. Generally, the processorreceives instructions and data from memory. Any of the foregoing may besupplemented by, or incorporated in, specially designed ASICs(application-specific integrated circuits).

Each module 946, 947, 948, 949 includes a set of computer programproducts executed by one or more processors such as the processors 952.Moreover, any of the modules 946, 947, 948, 949 can access data storedwithin the memory 950. Each module 946, 947, 948, 949 can be incommunication with one or more other modules 946, 947, 948, 949.

Although the controller 845 is represented as a box (in which all of itscomponents can be co-located), it is possible for the controller 845 tobe made up of components that are physically remote from each other. Forexample, the first control module 946 can be physically co-located withthe first gripping apparatus 800A or the sub-controller 830A.

The first control module 946 controls a phase of the first phase changematerial 825A. In particular, the first phase change material 825A iseither in a solid phase state in which the first phase change material825A grips the stick 805 or a liquid phase state in which the firstphase change material 825A loosens its grip on the stick 805 such thatthe stick is capable of moving through the first phase change material825A along the axial direction 810. Additionally, the second controlmodule 947 controls a phase of the second phase change material 825B.The second phase change material 825B is either in a solid phase statein which the second phase change material 825B grips the stick 805 or aliquid phase state in which the second phase change material 825Bloosens its grip on the stick 805 such that the stick 805 is capable ofmoving through the second phase change material 825B along the axialdirection 810. The actuator module 948 controls the relative positionbetween the first end 842_1 of the actuator drive 842 and a second end842_2 of the actuator drive 842 along the axial direction 810.

The controller 845 can provide a temporally-varying signal to theactuator drive 842. For example, the actuator module 948, by way of thesub-controller 831, can provide the temporally-varying signal to theactuator drive 842. The temporally-varying signal can be a repeatable orsomewhat repeatable signal, such as a periodic or pseudo-periodic signalor it can be an irregularly-shaped, yet changing signal that goesthrough steps to effect changes to the first and second grippingapparatuses 800A, 800B. It is not necessary for the periodic orpseudo-periodic signal to have a constant frequency. That is, thefrequency with which certain aspects of the signal repeat can change orcan include multiple frequencies. Moreover, it is possible for thesignal to change its amplitude from each full cycle to the next fullcycle.

A position of the stick 805 along the axial direction 810 is adjusted byadjusting the one or more signals provided from the first control module946 to the first gripping apparatus 800A and from the second controlmodule 947 to the second gripping apparatus 800B. Moreover, the positionof the stick 805 along the axial direction 810 is adjusted withoutadjusting a signal provided from the actuator module 948 to the actuatordrive 842.

The master control module 949 controls the signals provided to each ofthe first control module 946, the second control module 947, and theactuator module 948.

In other implementations, it is possible for the controller 845 toinclude fewer modules than what is described and shown in FIG. 9, orthat one or more of the modules described and shown in FIG. 9 arecombined into a single module or eliminated altogether.

The positioning apparatus 840 is configured to move the stick 805 alongthe axial direction 810. FIGS. 10A and 10B show an implementation of howthe stick 805 is moved along the −z direction. FIGS. 11A and 11B show animplementation of how the stick 805 is moved along the +z direction.FIGS. 12A and 12B show an implementation of how the stick 805 remainsstationary along the z axis even though the temporally-varying signalprovided from the actuator module 948 to the actuator drive 842 isuninterrupted (and not halted). Each of these implementations arediscussed next.

With reference to FIG. 10A, a side cross-sectional view of thepositioning apparatus 840 is shown at eight distinct times [(i), (ii),(iii), (iv), (v), (vi), (vii), (viii)] in a signal cycle in order toaffect the movement or translation of the stick 805 along the −zdirection. FIG. 10B is a timing diagram showing the corresponding threesignal amplitudes versus time (in arbitrary units). The top signal is asignal 1033A provided by the sub-controller 830A to the firsttemperature adjusting device 815A of the first gripping apparatus 800A.The signal 1033A provided to the first temperature adjusting device 815Acontrols a temperature of the first temperature adjusting device 815A,which therefore controls the temperature and a phase of the first phasechange material 825A. The bottom signal is a signal 1033B provided bythe sub-controller 830B to the second temperature adjusting device 815Bof the second gripping apparatus 800B. The signal 1033B provided to thesecond temperature adjusting device 815B controls a temperature of thesecond temperature adjusting device 815B, which therefore controls thetemperature and a phase of the second phase change material 825B. And,the middle signal is a signal provided by the sub-controller 831 to theactuator drive 842.

Initially, before time (i), the state of the positioning apparatus 840is as follows. The signal 1033A is at an OFF amplitude or level, whichmeans that the first temperature adjusting device 815A is below a firsttemperature and the first phase change material 825A is at a temperatureTA that is below the first transition temperature T1. Thus, the firstphase change material 825A of the first gripping apparatus 800A is in asolid state, and the first phase change material 825A grips the stick805 at the first region 805_1. The signal 1033B is at an OFF amplitudeor level, which means that the second temperature adjusting device 815Bis below a first temperature and the second phase change material 825Bis at a temperature TB that is below the first transition temperatureT1. Thus, the second phase change material 825B of the second grippingapparatus 800B is in a solid state, and the second phase change material825B grips the stick 805 at the second region 805_2. The stick 805 isfixed relative to the z axis. Additionally, the signal 1032 is at a LOWamplitude or level, and the voltage applied to the actuator drive 842 isat the LOW amplitude, which means that the actuator drive 842 is in acontracted state. An amplitude that is LOW can be a low non-zero valueor can be zero or off.

At time (i) (FIG. 10B), the signal 1033A has been changed to an ONamplitude or level and the signal 1033B is at an OFF amplitude or level.Additionally, the signal 1032 is at a LOW amplitude or level, and thevoltage applied to the actuator drive 842 is at the LOW amplitude, whichmeans that the actuator drive 842 is in a contracted state.

After a period of time from time (i), at time (ii), the firsttemperature adjusting device 815A is above a second temperature and thefirst phase change material 825A reaches a temperature TA that is abovethe second transition temperature T2. Thus, the first phase changematerial 825A of the first gripping apparatus 800A is in a liquid state(depicted by the dotted fill in FIG. 10A(ii)), and the first phasechange material 825A loosens its grip on the stick 805 at the firstregion 805_1. The signal 1033B remains at an OFF amplitude or level,which means that the temperature adjusting device 815B is below a firsttemperature and the second phase change material 825B is at atemperature TB that is below the first transition temperature T1. Thus,the second phase change material 825B of the second gripping apparatus800B is in a solid state (depicted by a grid fill in FIG. 10A(ii)), andthe second phase change material 825B grips the stick 805 at the secondregion 805_2. Additionally, the signal 1032 is still at a LOW amplitudeor level, and the voltage applied to the actuator drive 842 is at theLOW amplitude, which means that the actuator drive 842 is in acontracted state. Because of this, even though the grip on the stick 805is loosened at the first region 805_1, the stick 805 remains fixedrelative to the z axis because the stick 805 is still gripped at thesecond region 805_2.

At time (iii), the signal 1033A remains at the ON amplitude, which meansthat the first phase change material 825A is at the temperature TA thatis above the second transition temperature T2, and the first phasechange material 825A of the first gripping apparatus 800A remains in theliquid state. Thus, the first phase change material 825A has a loosenedgrip on the first region 805_1 of the stick 805. The signal 1033Bremains at an OFF amplitude, which means that the second phase changematerial 825B is at a temperature TB that is below the first transitiontemperature T1, and the second phase change material 825B of the secondgripping apparatus 800B is in a solid state. Thus, the second phasechange material 825B grips the second region 805_2 of the stick 805.Now, though, the signal 1032 transitions to a HIGH amplitude or level,and the voltage applied to the actuator drive 842 is at the HIGHamplitude, which means that the actuator drive 842 moves to an expandedstate. In the expanded state, in this implementation, the second end842_2 of the actuator drive 842 is moved along the −z direction relativeto the first end 842_1 of the actuator drive 842. Because the secondgripping apparatus 800B is fixed to the second end 842_2 of the actuatordrive 842 at time (iii) and the grip on the stick 805 is loosened at thefirst region 805_1, the stick 805 is translated along the −z directionby an amount that corresponds to how much the second end 842_2 of theactuator drive 842 is moved.

At time (iv), the signal 1033A has been switched to an OFF amplitude forsome time, and the first phase change material 825A reaches thetemperature TA that is below the first transition temperature T1, andthe first phase change material 825A of the first gripping apparatus800A returns to the solid state, as depicted by the grid fill shown inFIG. 10A(iv). Thus, the first phase change material 825A grips the firstregion 805_1 of the stick 805. The signal 1033B remains at an OFFamplitude, which means that the second phase change material 825B is ata temperature TB that is below the first transition temperature T1, andthe second phase change material 825B of the second gripping apparatus800B is in a solid state. Thus, the second phase change material 825Bmaintains its grip on the second region 805_2 of the stick 805. Thesignal 1032 remains at a HIGH amplitude or level, and the voltageapplied to the actuator drive 842 is at the HIGH amplitude, which meansthat the actuator drive 842 remains in the expanded state. Because thestick 805 is gripped at both the first and second regions 805_1, 805_2,the stick 805 remains stationary at this time relative to the z axis.

At time (v), the signal 1033A remains at the OFF amplitude, which meansthat the first phase change material 825A is at the temperature TA thatis below the first transition temperature T1, and the first phase changematerial 825A of the first gripping apparatus 800A returns to the solidstate. Thus, the first phase change material 825A grips the first region805_1 of the stick 805. The signal 1033B is changed to an ON amplitudeor level. And, the signal 1032 remains at a HIGH amplitude or level, andthe voltage applied to the actuator drive 842 is at the HIGH amplitude,which means that the actuator drive 842 remains in the expanded state.

Eventually, after a period of time from time (v), such as at time (vi),the second phase change material 825B reaches a temperature TB that isabove the second transition temperature T2, and the second phase changematerial 825B of the second gripping apparatus 800B is in a liquidstate, as shown by the dotted fill in FIG. 10A(vi). Thus, the secondphase change material 825B loosens its grip on the second region 805_2of the stick 805. The signal 1032 remains at a HIGH amplitude or level,and the voltage applied to the actuator drive 842 is at the HIGHamplitude, which means that the actuator drive 842 remains in theexpanded state. The stick 805 remains stationary at this time relativeto the z axis even though the grip on the stick 805 is loosened at thesecond region 805_2 because the stick 805 is gripped at the first region805_1.

At time (vii), the signal 1033A remains at the OFF amplitude, whichmeans that the first phase change material 825A is at the temperature TAthat is below the first transition temperature T1, and the first phasechange material 825A of the first gripping apparatus 800A is in thesolid state. Thus, the first phase change material 825A grips the firstregion 805_1 of the stick 805. The signal 1033B remains at the ONamplitude, which means that the second phase change material 825B is ata temperature TB that is above the second transition temperature T2, andthe second phase change material 825B of the second gripping apparatus800B is in a liquid state. Thus, the second phase change material 825Bremains in a state in which its grip on the second region 805_2 of thestick 805 is loosened. The signal 1032 changes from the HIGH amplitudeto the LOW amplitude, and the voltage applied to the actuator drive 842switches to the LOW amplitude, which means that the actuator drive 842changes to the contracted state. The stick 805 remains stationary atthis time because the stick 805 is gripped at the first region 805_1,which is fixed to the first gripping apparatus 800A, which is notmoving, and although the second gripping apparatus 800B is moving alongthe +z direction, the stick 805 does not move along because the secondregion 805_2 of the stick is not gripped by the second grippingapparatus 800B.

At time (viii), the signal 1033A remains at the OFF amplitude, whichmeans that the first phase change material 825A is at the temperature TAthat is below the first transition temperature T1, and the first phasechange material 825A of the first gripping apparatus 800A is in thesolid state. Thus, the first phase change material 825A grips the firstregion 805_1 of the stick 805. The signal 1033B was switched to the OFFamplitude after time (viii) and before time (viii), and eventually, attime (viii), the second phase change material 825B reaches a temperatureTB that is below the first transition temperature T1, and the secondphase change material 825B of the second gripping apparatus 800B is inthe solid state, as depicted by the grid fill in FIG. 10A(viii). Thus,the second phase change material 825B has switched to the state in whichit grips the second region 805_2 of the stick 805. The signal 1032remains at the LOW amplitude, which means that the actuator drive 842 isin the contracted state. The stick 805 remains stationary at this timebecause the stick 805 is gripped at the first region 805_1 and at thesecond region 805_2.

The ON amplitude of the signal 1033A and 1033B as well as the timeduring which the signal 1033A, 1033B remains at the ON amplitude, andthe ON voltage of the signal 1032 and the time during which the signal1032 is at the ON voltage depend on factors such as the resistance,size, and materials of the phase change materials 825A, 825B and initialtemperatures of various components of the first and second grippingapparatuses 800A, 800B.

In some implementations, the ON amplitude of the signal 1033A or 1033Bcan correspond to about tens or hundreds (for example, 10-200)milliamperes (mA) while the ON voltage of the signal 1032 supplied tothe actuator drive 842 can be on the order of several tens or hundreds(for example, 10-200) volts (V). The time during which the signal 1033Aor 1033B remains with an ON amplitude can be on the order of several,tens, or hundreds of (for example, 1-1000) milliseconds (ms) while thetime during which the signal 1032 is at the ON voltage (and the actuatordrive 842 is in the expanded state) can be on the order of a second orseveral seconds (for example, 0.1-10 s).

Moreover, it is possible that a temperature and an environment of thefirst gripping apparatus 800A is different from a temperature and anenvironment of the second gripping apparatus 800B during operation ofthe positioning apparatus 840, depending on the application and use ofthe positioning apparatus 840. For example, the second grippingapparatus 800B may be positioned closer to or in contact with awarm-bodied animal, which can raise the temperature of the secondgripping apparatus 800B relative to the first gripping apparatus 800A(which would be farther from the warm-bodied animal).

It should also be noted that because of this, the first and secondtransition temperatures T1 and T2 of the first phase change material825A may be distinct from the first and second transition temperaturesT1 and T2 of the second phase change material 825B. For simplicity indescription of FIGS. 10A, 10B, 11A, 11B, 12A, and 12B, it is assumedthat when referencing the first and second transition temperatures T1and T2, these are the values specific to the phase change material 825Aor 825B being described.

With reference to FIG. 11A, a side cross-sectional view of thepositioning apparatus 840 is shown at eight distinct times [(i), (ii),(iii), (iv), (v), (vi), (vii), (viii)] in a signal cycle in order toaffect the movement or translation of the stick 805 along the +zdirection. FIG. 11B is a timing diagram showing the corresponding threesignal amplitudes (1033A, 1033B, and 1032) versus time (in arbitraryunits).

Initially, before time (i), the state of the positioning apparatus 840is as follows. The signal 1033A is at an OFF amplitude or level, andthus the first phase change material 825A of the first grippingapparatus 800A is in a solid state, and the first phase change material825A grips the stick 805 at the first region 805_1. The signal 1033B isat an OFF amplitude or level, and thus the second phase change material825B of the second gripping apparatus 800B is in a solid state, and thesecond phase change material 825B grips the stick 805 at the secondregion 805_2. The stick 805 is fixed relative to the z axis.Additionally, the signal 1032 is at a LOW amplitude or level, and thevoltage applied to the actuator drive 842 is at the LOW amplitude, whichmeans that the actuator drive 842 is in a contracted state.

At time (i), the signal 1033A remains at an OFF amplitude or level,which means that the first temperature adjusting device 815A is below afirst temperature and the first phase change material 825A is at atemperature TB that is below the first transition temperature T1. Thus,the first phase change material 825A of the first gripping apparatus800A is in a solid state, and the first phase change material 825A gripsthe stick 805 at the first region 805_1. The signal 1033B is changed toan ON amplitude or level. Additionally, the signal 1032 is at a LOWamplitude or level, and the voltage applied to the actuator drive 842 isat the LOW amplitude, which means that the actuator drive 842 is in acontracted state.

After a period of time beyond time (i), at time (ii), the secondtemperature adjusting device 815B reaches a second temperature and thesecond phase change material 825B is at a temperature TB that is abovethe second transition temperature T2. Thus, the second phase changematerial 825B of the second gripping apparatus 800B reaches a liquidstate, as shown by the dotted fill in FIG. 11A(ii), and the second phasechange material 825B loosens its grip on the stick 805 at the secondregion 805_2. At time (ii), the signal 1033A remains at an OFF amplitudeor level, thus, the first temperature adjusting device 815A is below afirst temperature and the first phase change material 825A is at atemperature TB that is below the first transition temperature T1. Thus,the first phase change material 825A of the first gripping apparatus800A is in a solid state, as shown by the grid fill in FIG. 11A(ii), andthe first phase change material 825A grips the stick 805 at the firstregion 805_1. Additionally, the signal 1032 is at a LOW amplitude orlevel, and the voltage applied to the actuator drive 842 is at the LOWamplitude, which means that the actuator drive 842 is in a contractedstate. Even though the grip on the stick 805 is loosened at the secondregion 805_2, the stick 805 remains fixed relative to the z axis becausethe stick 805 is still gripped at the first region 805_1.

At time (iii), the signal 1033A remains at the OFF amplitude, whichmeans that the first phase change material 825A is at a temperature TAthat is below the first transition temperature T1, and the first phasechange material 825A is in a solid state, as depicted by the grid fillin FIG. 11A(iii). Thus, the first phase change material 825A maintainsits grip on the first region 805_1 of the stick 805. The signal 1033Bremains at the ON amplitude, which means that the second phase changematerial 825B is at the temperature TB that is above the secondtransition temperature T2, and the second phase change material 825B ofthe second gripping apparatus 800B remains in the liquid state, asdepicted by the dotted fill in FIG. 11A(iii). Thus, the second phasechange material 825B maintains its loosened grip on the second region805_2 of the stick 805. Now, though, the signal 1032 to the actuatordrive 842 transitions to a HIGH amplitude or level, and the voltageapplied to the actuator drive 842 is at the HIGH amplitude, which meansthat the actuator drive 842 moves to an expanded state. In the expandedstate, in this implementation, the second end 842_2 of the actuatordrive 842 is moved along the −z direction relative to the first end842_1 of the actuator drive 842. Even though the second grippingapparatus 800B is fixed to the second end 842_2 of the actuator drive842 at time (iii), because the grip on the stick 805 is loosened at thesecond region 805_2, the stick 805 does not translate along the −zdirection with the second end 842_2 of the actuator drive 842.

At time (iv), the signal 1033A remains at an OFF amplitude, which meansthat the first phase change material 825A is at a temperature TA that isbelow the first transition temperature T1, and the first phase changematerial 825A is in a solid state, as depicted by the grid fill in FIG.11A(iv). Thus, the first phase change material 825A maintains its gripon the first region 805_1 of the stick 805. The signal 1033B wasswitched to an OFF amplitude before time (iv), and by the time (iv), thesecond phase change material 825B reaches the temperature TB that isbelow the first transition temperature T1, and the second phase changematerial 825B of the second gripping apparatus 800B returns to the solidstate, as depicted by the grid fill in FIG. 11A(iv). Thus, the secondphase change material 825B grips the second region 805_2 of the stick805. The signal 1032 remains at a HIGH amplitude or level, and thevoltage applied to the actuator drive 842 is at the HIGH amplitude,which means that the actuator drive 842 remains in the expanded state.Because the stick 805 is gripped at both the first and second regions805_1, 805_2, the stick 805 remains stationary at this time relative tothe z axis.

At time (v), the signal 1033A has been changed to an ON amplitude orlevel, and the signal 1033B remains at the OFF amplitude, which meansthat the second phase change material 825B is at the temperature TB thatis below the first transition temperature T1, and the second phasechange material 825B of the second gripping apparatus 800B remains inthe solid state and grips the second region 805_2 of the stick 805.Moreover, the signal 1032 remains at a HIGH amplitude or level, and thevoltage applied to the actuator drive 842 is at the HIGH amplitude,which means that the actuator drive 842 remains in the expanded state.

After a period of time form time (v), at time (vi), the first phasechange material 825A reaches a temperature TA that is above the secondtransition temperature T2, and the first phase change material 825A isin a liquid state, as depicted by the dotted fill in FIG. 11A(vi). Thus,the first phase change material 825A loosens its grip on the firstregion 805_1 of the stick 805. The signal 1033B remains at the OFFamplitude, which means that the second phase change material 825B ismaintained at the temperature TB that is below the first transitiontemperature T1, and the second phase change material 825B of the secondgripping apparatus 800B is in the solid state, as depicted by the gridfill in FIG. 11A(vi). Thus, the second phase change material 825B gripsthe second region 805_2 of the stick 805. The signal 1032 remains at aHIGH amplitude or level, and the voltage applied to the actuator drive842 is at the HIGH amplitude, which means that the actuator drive 842remains in the expanded state. The stick 805 remains stationary at thistime relative to the z axis even though the grip on the stick 805 isloosened at the first region 805_1 because the stick 805 is gripped atthe second region 805_2 and the actuator drive 842 is stationary.

At time (vii), the signal 1033A remains at the ON amplitude, which meansthat the first phase change material 825A is at a temperature TA that isabove the second transition temperature T2, and the first phase changematerial 825A is in a liquid state, as depicted by a dotted fill in FIG.11A(vii). Thus, the first phase change material 825A remains in a statein which its grip on the first region 805_1 of the stick 805 isloosened. The signal 1033B remains at the OFF amplitude, which meansthat the second phase change material 825B is maintained at thetemperature TB that is below the first transition temperature T1, andthe second phase change material 825B is in the solid state, as depictedby a grid fill in FIG. 11A(vii). Thus, the second phase change material825B grips the second region 805_2 of the stick 805. The signal 1032changes from the HIGH amplitude to the LOW amplitude, and the voltageapplied to the actuator drive 842 switches to the LOW amplitude, whichmeans that the actuator drive 842 changes to the contracted state. Thestick 805 moves or translates along the +z direction as the second end842_2 of the actuator drive 842 is moved along the +z direction relativeto the first end 842_1 of the actuator drive 842 because the secondgripping apparatus 800B is fixed to the second end 842_2 of the actuatordrive 842.

At time (viii), the signal 1033A has been switched to the OFF amplitude,and enough time has passed so that the first phase change material 825Ahas reached a temperature TA that is below the first transitiontemperature T1, and the first phase change material 825A is now in thesolid state, as depicted by the grid fill in FIG. 11A(viii). Thus, thefirst phase change material 825A has switched to the state in which itgrips the first region 805_1 of the stick 805. The signal 1033B remainsat the OFF amplitude, which means that the second phase change material825B is at the temperature TB that is below the first transitiontemperature T1, and the second phase change material 825B is in thesolid state. Thus, the second phase change material 825B grips thesecond region 805_2 of the stick 805. The signal 1032 remains at the LOWamplitude, which means that the actuator drive 842 is maintained in thecontracted state. The stick 805 remains stationary at this time becausethe stick 805 is gripped at the first region 805_1 and at the secondregion 805_2.

With reference to FIG. 12A, a side cross-sectional view of thepositioning apparatus 840 is shown at eight distinct times [(i), (ii),(iii), (iv), (v), (vi), (vii), (viii)] in a signal cycle in which thestick 805 remains stationary relative to the z axis even though theactuator drive 842 is operating to expand and contract. FIG. 12B is atiming diagram showing the corresponding three signal amplitudes (1033A,1033B, and 1032) versus time (in arbitrary units).

In general, the stick 805 remains stationary at all times in this signalcycle because the signal 1033A provided to the first temperatureadjusting device 815A remains at an OFF amplitude and thus the firstphase change material 825A remains in a solid phase state, which meansthat it is always gripping the first end 842_1 of the actuator drive842. This is depicted in FIG. 12A by the grid fill in the first phasechange material 825A. The first gripping apparatus 800A is thereforefixed to the first end 842_1 of the actuator drive 842 at all times, andbecause the first end 842_1 remains stationary, the first region 805_1of the stick 805 remains stationary.

Moreover, in order to prevent breakage because of the motion of thesecond end 842_2 of the actuator drive 842, the signal 1033B is adjustedin coordination with the signal 1032, as follows. The signal 1033B isswitched an ON amplitude at time (i) and enough time is allowed to passso that at time (ii), the second phase change material 825B of thesecond gripping apparatus 800B reaches a temperature TB that is abovethe second transition temperature T2 and is in the liquid state. This isdone in advance of the translation of the second end 842_2 along the −zdirection of the actuator drive 842 at time (iii). In this way, thesecond end 842_2 of the actuator drive 842 can move at time (iii)without applying a force to the stick 805 in the −z direction. Then, thesignal 1033B is switched to an OFF amplitude, and after a period of timefrom this, at time (iv), the second phase change material 825B hasmanaged to cool down enough and drops below the first transitiontemperature T1 so that the second phase change material 825B is now in asolid state, as depicted by the grid fill in FIG. 12A(iv).

At time (v), the signal 1033B is adjusted to an ON amplitude and afterenough time has elapsed, at time (vi), the second phase change material825B of the second gripping apparatus 800B reaches a temperature TB thatis above the second transition temperature T2 and is in the liquidstate, as depicted by the dotted fill in FIG. 12A(vi). This is done inadvance of switching the signal 1032 to a LOW amplitude or level at time(vii), which causes the translation of the second end 842_2 along the +zdirection of the actuator drive 842 at time (vii) to enable the secondend 842_2 of the actuator drive 842 to move at time (vii) withoutapplying a force to the stick 805 in the +z direction. The signal 1033Bis again switched to an OFF amplitude, and after a period of time fromthis, at time (viii), the second phase change material 825B has managedto cool down enough and drops below the first transition temperature T1so that the second phase change material 825B is now in a solid state,as depicted by the grid fill in FIG. 12A(viii).

In general, if top (the first) temperature adjusting device 815A remainsat an OFF amplitude and the bottom (the second) temperature adjustingdevice 815B is at an ON amplitude, then the stick 805 is fixed in theaxial direction. In general, if top (the first) temperature adjustingdevice 815A is at an ON amplitude and the bottom (the second)temperature adjusting device 815B is at an OFF amplitude, then the stick805 is movable in the axial direction. In these implementations, thefirst temperature adjusting device 815A and the second temperatureadjusting device 815B are never at the ON amplitude or the OFF amplitudeat the same time during motion of the stick 805.

Referring also to FIG. 13, a positioning apparatus 1360 is designed toindependently translate each stick of a plurality of sticks 1305 i, 1305ii, 1305 iii, etc. along an axial direction of that stick using a singleactuator drive 1342 movable along its own axial direction 1310, which isparallel with the z axis. The sticks 1305 i, 1305 ii, 1305 iii are shownfor reference in FIG. 13 but are not necessarily a part of thepositioning apparatus 1360. Moreover, while three sticks 1305 i, 1305ii, 1305 iii are shown, fewer or greater than three sticks can becontrolled by the positioning apparatus 1360.

The positioning apparatus 1360 includes a plurality of axial holders1365 i, 1365 ii, 1365 iii, etc. Each axial holder 1365 i, 1365 ii, 1365iii is configured to receive a respective stick 1305 i, 1305 ii, 1305iii. Additionally, each axial holder 1365 i, 1365 ii, 1365 iii is fixedto the actuator drive 1342 at respective fixing mechanisms 1366 i, 1366ii, 1366 iii.

The positioning apparatus 1360 includes a controller 1345 incommunication with the single actuator drive 1342 (for example, via thesub-controller 1331), and with the plurality of axial holders 1365 i,1365 ii, 1365 iii (for example, via a sub-controller 1330). Thecontroller 1345 is configured to provide an actuation signal to thesingle actuator drive 1342 (by way of the sub-controller 1331). Thecontroller 1345 is also configured to provide at least one independentsignal to each of the axial holders 1365 i, 1365 ii, 1365 iii by way ofthe sub-controller 1330). The position of each stick 1305 i, 1305 ii,1305 iii can be independently adjustable along its respective axialdirection (which is parallel with the z axis and the axial direction1310) by the adjustment of the provided at least one independent signalto each of the axial holders 1365 i, 1365 ii, 1365 iii without adjustingthe provided actuation signal to the single actuator drive 1342, as longas each axial holder 1365 i, 1365 ii, 1365 iii is thermally independentof the other axial holders 1365 i, 1365 ii, 1365 iii.

In particular, the actuation signal to the actuator drive 1342 can be atemporally-varying signal that toggles between a low amplitude (in whichthe voltage applied to the actuator drive 1342 is relatively low) and ahigh amplitude (in which the voltage applied to the actuator drive 13423is relatively high).

In some implementations, the positioning apparatus 1360 is designed likethe positioning apparatus 1460 of FIGS. 14 and 15. Each axial holder1465 i, 1465 ii, 1465 iii is configured to receive a respective stick1405 i, 1405 ii, 1405 iii. Moreover, each axial holder 1465 i, 1465 ii,1465 iii is defined by a pair of respective first and second grippingapparatuses (1400 iA, 1400 iB), (1400 iiA, 1400 iiB), and (1400 iiiA,1400 iiiB). For example, the axial holder 1465 i is defined by a portionof the first gripping apparatus 1400 iA and the second grippingapparatus 1400 iB; the axial holder 1465 ii is defined by a portion ofthe first gripping apparatus 1400 iiA and the second gripping apparatus1400 iiB; and the axial holder 1465 iii is defined by a portion of thefirst gripping apparatus 1400 iiiA and the second gripping apparatus1400 iiiB. While three axial holders 1465 i, 1465 ii, 1465 iii are shownin this implementation, it is possible for the positioning apparatus1460 to have more than or fewer than three axial holders.

The distance d between the sticks 1305 i, 1305 ii, 1305 iii isdetermined depending on the application or the use of the sticks 1305 i,1305 ii, 1305 iii and also is configured to provide for independentthermal control of the sticks 1305 i, 1305 ii, 1305 iii. This means thatthe distance d (relative to the extent or diameter of each stick) isgreat enough to enable independent thermal control of each stick. Whenone stick is being controlled, the axial holder 1365 associated withthat stick includes a phase change material that is heated or cooled.The distance d is great enough so that the heating or cooling of thephase change material of one axial holder (associated with a particularstick) is thermally insulated or independent from the phase changematerial(s) of another axial holder associated with another stick.Indeed, the distance d is large enough to ensure thermal insulationbetween the sticks to enable heating of the phase change material(s)associated with a plurality of sticks that are adjacent to a particularstick in which the phase change material(s) of that particular stick iskept at a relatively cooler temperature. The distance d can depend onother factors such as a size or volume of the phase change material oran application of use for the positioning apparatus 1360. To the extentthat heat flows between the phase change materials of each axial holderor if each axial holder begins at a different temperature at a beginningof a cycle, the heating amplitudes and durations of heating can beadjusted such that all of the phase change material that is intended tomelt does so at the same time and any excess heat reaching those notintended to melt is reduced or minimized.

For example, d can be on the order of a few times the size or extent(for example, a diameter) of the sticks. The distance d can be 3-6 timesthe value of the diameter of the sticks. Thus, if the diameter of eachof the sticks is about 100 μm, then the distanced between the sticks canbe about 250-1000 μm.

The first gripping apparatus 1400 iA is configured to interact with(grip and release) a first region of the stick 1405 i and the secondgripping apparatus 1400 iB is configured to interact with (grip andrelease) a second region of the stick 1405 i. The first grippingapparatus 1400 iiA is configured to interact with (grip and release) afirst region of the stick 1405 ii and the second gripping apparatus 1400iiB is configured to interact with (grip and release) a second region ofthe stick 1405 ii. Lastly, the first gripping apparatus 1400 iiiA isconfigured to interact with (grip and release) a first region of thestick 1405 iii and the second gripping apparatus 1400 iiiB is configuredto interact with (grip and release) a second region of the stick 1405iii.

Additionally, each axial holder 1465 i, 1465 ii, 1465 iii is fixed tothe actuator drive 1442 by fixing each of the respective first grippingapparatuses 1400 iA, 1400 iiA, 1400 iiiA and each of the second grippingapparatuses 1400 iB, 1400 iiB, 1400 iiiB to the actuator drive 1442. Oneway to accomplish this is to arrange the first gripping apparatuses 1400iA, 1400 iiA, 1400 iiiA on a shared first substrate 1420A and to arrangethe second gripping apparatuses 1400 iB, 1400 iiB, 1400 iiiB on a sharedsecond substrate 1420B. In this way, the axial holders 1465 i, 1465 ii,1465 iii are fixed to the actuator drive 1442 by way of a shared fixingmechanism 1466 that includes both the first substrate 1420A and thesecond substrate 1420B. The first substrate 1420A is fixed to the firstend 1442_1 of the actuator drive 1442 and the second substrate 1420B isfixed to the second end 1442_2 of the actuator drive 1442.

The gripping apparatuses (1400 iA, 1400 iB) associated with the axialholder 1465 i are aligned with each other along the axial directionwhich is parallel with the z axis. In this way, the stick 1405 i that isreceived in the axial holder 1465 i is free to translate along the zaxis with minimal forces applied in the directions perpendicular to thez axis. Similarly, the gripping apparatuses (1400 iiA, 1400 iiB)associated with the axial holder 1465 ii are aligned with each otheralong the axial direction which is parallel with the z axis. In thisway, the stick 1405 i that is received in the axial holder 1465 ii isfree to translate along the z axis with minimal forces applied in thedirections perpendicular to the z axis. Lastly, the gripping apparatuses(1400 iiiA, 1400 iiiB) associated with the axial holder 1465 iii arealigned with each other along the axial direction which is parallel withthe z axis. In this way, the stick 1405 iii that is received in theaxial holder 1465 iii is free to translate along the z axis with minimalforces applied in the directions perpendicular to the z axis.

Each of the first gripping apparatuses 1400 iA, 1400 iiA, 1400 iiiA isdesigned similarly to the first gripping apparatus 800A in that itcontains a first phase change material such as 825A that is configuredto receive a first region of the respective stick 1405 i, 1405 ii, 1405iii and also a first temperature adjusting device such as 815A that isreceived in the first substrate 1420A. Each first temperature adjustingdevice in each first gripping apparatus 1400 iA, 1400 iiA, 1400 iiiA isin communication with a sub-controller 1430A, which is in communicationwith the controller 1445. The first phase change material is thermallycoupled with the first temperature adjusting device such that atemperature change in the first temperature adjusting device causes atemperature change in the first phase change material.

Each of the second gripping apparatuses 1400 iB, 1400 iiB, 1400 iiiB isdesigned similarly to the second gripping apparatus 800B in that itcontains a second phase change material such as 825B that is configuredto receive a second region of the respective stick 1405 i, 1405 ii, 1405iii and also a second temperature adjusting device such as 815B that isreceived in the second substrate 1420B. Each second temperatureadjusting device in each second gripping apparatus 1400 iB, 1400 iiB,1400 iiiB is in communication with a sub-controller 1430B, which is incommunication with the controller 1445. The second phase change materialis thermally coupled with the second temperature adjusting device suchthat a temperature change in the second temperature adjusting devicecauses a temperature change in the second phase change material.

The controller 1445 (by way of the sub-controller 1431) provides theactuation signal to the single actuator drive 1442. For example, theactuation signal can be temporally-varying like the signal 1032 (withreference to FIG. 10B). This temporally-varying signal 1032 controls anaxial position associated with the single actuator drive 1442.

Additionally, the controller 1445 can provide an independent signal (orsignals) to each of the axial holders 1465 i, 1465 ii, 1465 iii. Thiscan be accomplished by sending a first signal to the first grippingapparatus 1400 iA, 1400 iiA, or 1400 iiiA via the sub-controller 1430Aand sending a second signal to the second gripping apparatus 1400 iB,1400 iiB, or 1400 iiiB via the sub-controller 1430B. In particular, theindependent signal that is provided to a gripping apparatus is actuallyprovided to the temperature adjusting device associated with thatgripping apparatus, and the state of a particular phase change materialis selected by adjustment of the provided independent signal to thetemperature adjusting device thermally coupled with the phase changematerial.

In operation, the positioning apparatus 1360 (and 1460) is used toindependently control the position of each stick 1305 i, 1305 ii, 1305iii along its respective axial direction and using only a singleactuator drive 1342. FIGS. 16A-16E show examples of variousconfigurations of the sticks 1305 i, 1305 ii, 1305 iii. The sticks 1305i, 1305 ii, 1305 iii are positioned relative to an element 1670. Asdiscussed above, the sticks 1305 i, 1305 ii, 1305 iii can be used asactuators to effect or modify one or more characteristics of the element1670. For example, each stick 1305 i, 1305 ii, 1305 iii can include anelectrical conductor (such as a cable or wire); a measurement probe; acapillary tube; an optical waveguide; an optical fiber; a carbon fiberor filament; or a sonic waveguide. If the stick 1305 i, 1305 ii, 1305iii is a measurement probe, then it could include an electrical testingprobe, a silicon probe, an electrical recording probe, or an ultrasonicprobe. In some implementations, one or more of the sticks 1305 i, 1305ii, 1305 iii can be of a first type (such as an electrical conductor(such as a cable or wire)) while one of the sticks can be of a secondtype (such as a measurement probe; a capillary tube; an opticalwaveguide; an optical fiber; a carbon fiber or filament; or a sonicwaveguide). Thus, it is possible for a particular positioning apparatus1360, 1460 to include sticks of different types.

For example, in FIG. 16A, each of the sticks 1305 i, 1305 ii, 1305 iiiis at the same axial position (along the z direction) relative to theelement 1670 and in this case the sticks 1305 i, 1305 ii, 1305 iii areall separated from the element 1670. In FIG. 16B, each of the sticks1305 i, 1305 ii, 1305 iii is at the same axial position relative to theelement 1670 and in this case, the sticks 1305 i, 1305 ii, 1305 iii areinteracting with the element 1670 at a first interacting axial position.In FIG. 16C, sticks 1305 i, 1305 ii are interacting with the element1670 at the first interacting axial position and the stick 1305 iii isinteracting with the element 1670 at a second interacting axialposition. In FIG. 16D, the stick 1305 i is interacting with the element1670 at the first interacting axial position and the sticks 1305 ii,1305 iii are interacting with the element 1670 at the second interactingaxial position. In FIG. 16E, the sticks 1305 i, 1305 iii are separatedfrom the element 1670 at the same axial position and the stick 1305 iiis interacting with the element 1670 at the first interacting axialposition.

FIGS. 17A-17D show implementations of the placement and geometry ofaxial holders (such as 1400 iA, 1400 iiA, 1400 iiiA) on a firstsubstrate (such as the first substrate 1420A) to be used in apositioning apparatus (such as the positioning apparatus 1460). In FIG.17A, a substrate 1720 such as a printed circuit board or PCB includes ablank region BR (such as the substrate 120 shown in FIG. 7A). Also shownin FIG. 17A is a controller 1730.

In FIG. 17B, sixteen open regions 1722 are have been formed, each openregion 1722 having a circular cross section and being placed within thepreviously blank region BR of the substrate 1720. This is similar to theformation of the open region 122 in the substrate 120 of FIG. 7B. Forexample, the open regions 1722 can be holes drilled into the blankregion BR. The PCB can include thermally-conductive and sinking metalplanes slightly separated from the open regions 1722 to facilitate heattransfer away from the open regions 1722 in use.

In FIG. 17C, sixteen temperature adjusting devices 1715 are formed to beheld within the substrate 1720 (for example, in each of the open regions1722). For example, the temperature adjusting devices 1715 can be aresistive material epoxied into each open region 1722, which can besoldered at FIG. 17D. This is similar to the step shown in FIG. 7C. Aclose-up of one of the temperature adjusting devices 1715 and openregions 1722 is shown in FIG. 17D.

FIGS. 18A, 18B, and 18D show perspective views of a positioningapparatus 1860 designed like the positioning apparatus 1360 of FIG. 13and the positioning apparatus 1460 of FIG. 14. The positioning apparatus1860 includes a set of axial holders configured to receive a respectivestick 1805 (collectively designated as 1805 in FIG. 18A, 18B, 18D). Eachaxial holder is defined by a pair of respective first and secondgripping apparatuses (collectively designated as 1800A, 1800B. Forexample, each axial holder is defined by a portion of the first grippingapparatus 1800A and the second gripping apparatus 1800B. Each of thefirst gripping apparatuses 1800A is formed on a shared substrate 1820Aand each of the second gripping apparatuses 1800B is formed on a sharedsubstrate 1820B.

The positioning apparatus 1860 is designed to independently translateeach stick of the plurality of sticks 1805 along an axial direction ofthat stick using a single actuator drive 1842 movable along its ownaxial direction, which is parallel with the z axis, and under control ofa controller 1845, as discussed above. The controller 1845 is incommunication with the single actuator drive 1842, and with theplurality of axial holders via a sub-controller that includes components1830.

FIGS. 18C and 18E show the sticks 1805 that are positionable with thepositioning apparatus 1860.

FIG. 19A shows a schematic of the placement and geometry of axialholders (such as 1400 iA, 1400 iiA, 1400 iiiA) on a first substrate(such as the first substrate 1420A) to be used in a positioningapparatus (such as the positioning apparatus 1460). In FIG. 19A, eightaxial holders are shaped with a circular cross section and are within anarea 1990A of substrate 1920A and details of the area 1900A are shown inFIG. 19B. The design of the axial holders in area 1990A uses a chipresistor 1915 embedded within an open region 1922 that receives a phasechange material. This is similar to the design shown in FIGS. 5A and 5B.The chip resistor 1915 is controlled by a controller (such as controller130), which includes the power source that supplies the current to thechip resistor 1915 by way of electrically conductive elements 1916,1917.

In some implementations the gripping apparatus 100 is a stick gripperincluding a stick such as a probe. The stick gripper includes anelectrically-connected resistive via (as a temperature adjusting device)in a board (such as a printed circuit board) filled with a phase changematerial 125 (for example, a wax or paraffin). When no current from apower supply flows through the resistive via, the phase change material125 in the via is in a solid state and the probe in the via is gripped.When the current flows through the resistive via, the phase changematerial 125 in the via changes to the liquid state (melts) and theprobe in the via is released. The phase change material 125 in theliquid state remains in the via due at least in part to the capillaryaction. The grip and release action of the gripper is controlledelectronically. The resistive via can be made of a plated or depositedresistive material in the board via, chip resistor adjacent to the boardvia, wire-wound resistor in the board via, or carbon paste coated in theboard via.

In other implementations, a positioning apparatus (such as the apparatus840 or the apparatus 1360) is based on the gripping apparatus 100 thatis capable of independently moving multiple probes along one axis usinga single mechanical (for example, screw based drive), electrical (forexample, piezoelectric actuator or stepper motor), or thermal (forexample, shape memory alloy) positioner. The positioning apparatusincludes two parallel substrates (or boards such as printed circuitboards) with a single (such as the apparatus 840) or an array ofresistive vias aligned along one axis (such as the apparatus 1360). Oneboard is fixed/immobile while another board is movable/mobile by apositioner/actuator (the actuator drive 842 or 1342). By electronicallycontrolling the current though the aligned vias (and therefore the gripor release of the probes in the vias) in the respective top and bottomboards, each probe held in the device can be independently translated ineither direction (up or down or fixed in position) with a singlemechanical or electronic actuator. The probes in the board vias moved bythe device can be of any shape, as the liquid phase change material inthe board via that grips the probe conforms to the probe shape.

Examples of the stick 105, 805, 1305 i, ii, iii include electricaltesting probes, optical fibers, silicon probes, glass pipette/capillary,carbon fibers, electrical recording probes, and ultrasonic probes. Thepositioning apparatus and gripping apparatus can be constructed fromnon-ferrous parts and therefore can be made MRI compatible. The wireelectrodes and glass capillary pipette electrodes for neural cellelectrical spike detection, and applications in which one or multipleclosely spaced probes need to be translated, positioned, or targetedwith high precision are envisioned with this probe gripper principle andpositioner device.

The choice of the phase change material in the board vias can be made sothat the device is operational at different operating temperatures (lowtemperature operation, room temperature operation, physiologicaltemperature operation, high temperature operation).

The gripping apparatus 100, the positioning apparatus 840, and thepositioning apparatus 1360 have the following benefits. For example, aplurality of probes can be independently positioned with singlepositioner/actuator, such as, for example, shown in FIG. 13, and becauseof this size, cost, and complexity can be reduced while density can beincreased relative to prior designs.

Each gripping apparatus 100 (which includes the phase change material125, the temperature adjusting device 115, and the substrate 120 can bemade small and has a simple design, and many of these grippingapparatuses can be packed next to each other to form a positioningapparatus such as the positioning apparatus 860. For example,micron-scale independent positioning of each stick 1305 i, 1305 ii, 1305iii in the positioning apparatus 1360 can be obtained with anelectric/motorized actuator drive 1342 (which can be a positioner suchas, for example, a piezoelectric actuator). Accordingly, there ispotential for significant miniaturization and weight reduction.

The phase change material 125 remains in the open region 122 of thesubstrate 120 at least in part due to capillary action.

Any of the apparatuses (gripping apparatus 100, positioning apparatus840, and positioning apparatus 1360) can be made to be fullyelectronically operational which allows remote control and automation ofthe apparatuses.

Technology that is implemented on a substrate 120 that is a printedcircuit board is well-developed and inexpensive.

The gripping apparatus 100 can be designed to interact with a stick 105of different shapes or application. For example, the stick 105 or one ormore of the sticks used in the positioning apparatus 1360 can be anelectrical probe, a silicon probe, a glass pipette, a carbon or opticalfiber, an ultrasonic probe. In general, any stick 105 that is stiffenough to be grabbed by the phase change material 125 can be used.

The gripping apparatus 100, positioning apparatus 840, and positioningapparatus 1360 can be made of non-ferrous components, which potentiallymake these apparatuses compatible with magnetic resonance imagingmachines. Additionally, the choice of phase change material 125 in theapparatuses allows for operation at different temperatures chosen basedon the application.

The gripping apparatus 100, and the positioning apparatuses 840, 1360find applications in neuroscience where independent positioning of manyprobes in the brain is desired. Multiple probes can be independentlypositioned with single translator (actuator drive) as opposed to pluraltranslators. Simplicity, miniature gripper size, low cost, low weight,high positioning precision, variety of probes that can be gripped andtranslated, and fully electronic operation add to the valuable featuresof the gripping apparatus 100 and the positioning apparatuses 840, 1360.

The invention claimed is:
 1. A positioning apparatus comprising: anactuator drive movable along an axial direction; a first grippingapparatus fixed to the actuator drive, the first gripping apparatuscomprising a first phase change material that is configured to receive afirst region of a stick; a second gripping apparatus fixed to theactuator drive, the second gripping apparatus comprising a second phasechange material that is aligned along an axial direction with the firstphase change material and that is configured to receive a second regionof the stick; and a controller connected to the first grippingapparatus, the second gripping apparatus, and to the actuator drive, andconfigured to: provide one or more signals to the actuator drive, thefirst gripping apparatus, and the second gripping apparatus; wherein oneor more signals provided to the first gripping apparatus control a phaseof the first phase change material and one or more signals provided tothe second gripping apparatus control a phase of the second phase changematerial; wherein a position of the stick along the axial direction isadjusted or held constant depending on the one or more signals providedto the actuator drive, the first gripping apparatus, and the secondgripping apparatus.
 2. The positioning apparatus of claim 1, wherein:the actuator drive has a first end and a second end; the first andsecond ends are movable relative to each other; the first grippingapparatus is fixed to the first end of the actuator drive; and thesecond gripping apparatus is fixed to the second end of the actuatordrive.
 3. The positioning apparatus of claim 2, wherein the actuatordrive comprises one or more of: a turnable screw configured to turnabout the axial direction to thereby translate the second end relativeto the first end along the axial direction; a stepper motor configuredto move the second end relative to the first end along the axialdirection; a shape memory alloy configured to expand or contract tothereby adjust a relative position between the first end and the secondend; and a piezoelectric actuator configured to move the second endrelative to the first end along the axial direction.
 4. The positioningapparatus of claim 2, wherein the first end of the actuator drive isfixed and the second end of the actuator drive is movable relative tothe first end of the actuator drive.
 5. The positioning apparatus ofclaim 2, wherein: an axial holder is formed from the first grippingapparatus fixed to the first end of the actuator drive and the secondgripping apparatus fixed to the second end of the actuator drive; andthe second gripping apparatus is aligned along an axial direction withthe first gripping apparatus.
 6. The positioning apparatus of claim 5,comprising a plurality of axial holders, with each axial holder beingconfigured to receive a stick and each axial holder being fixed to theactuator drive; wherein the controller is in communication with each ofthe axial holders and is configured to provide at least one independentsignal to each of the axial holders whereby the position of each stickis independently adjustable along the axial direction by the adjustmentof the provided at least one independent signal to each of the axialholders without adjusting the provided actuation signal to the actuatordrive.
 7. The positioning apparatus of claim 6, wherein: providing theactuation signal to the actuator drive comprises providing atemporally-varying signal to the actuator drive, the temporally-varyingsignal controlling an axial position associated with the actuator drive.8. The positioning apparatus of claim 6, wherein: each axial holder isconfigured to interact with at least two interaction regions of itsassociated stick; at each interaction region, the stick is received in agripping apparatus; and providing at least one independent signal toeach of the axial holders comprises providing an independent signal toeach gripping apparatus in each axial holder.
 9. The positioningapparatus of claim 8, wherein each gripping apparatus comprises: atemperature adjusting device; and a phase change material thermallycoupled with the temperature adjusting device such that a temperaturechange in the temperature adjusting device causes a temperature changein the phase change material; wherein providing the independent signalto a gripping apparatus comprises providing an independent signal to thetemperature adjusting device, and the state of the phase change materialis selected by adjustment of the provided independent signal to thetemperature adjusting device thermally coupled with the phase changematerial.
 10. The positioning apparatus of claim 9, wherein eachtemperature adjusting device comprises a resistive conductive wire andthe controller includes a power source that supplies a current to theresistive conductive wire, wherein the resistive conductive wire changesits temperature as the current is changed.
 11. The positioning apparatusof claim 9, wherein each temperature adjusting device comprises one ormore of: a resistive material deposited in an open region of asubstrate; a chip resistor adjacent to an open region of a substrate; awire-wound resistor in an open region of a substrate; and a carbon pastecoated in an open region of a substrate.
 12. The positioning apparatusof claim 9, wherein each phase change material is held within an openregion of a substrate of that gripping apparatus by way of capillaryforces.
 13. The positioning apparatus of claim 12, wherein each phasechange material remains within its open region even if the phase changematerial is in the liquid state.
 14. The positioning apparatus of claim1, wherein the actuator drive is movable along only the axial directionunder control of the controller.
 15. The positioning apparatus of claim1, wherein: the first gripping apparatus further comprises: a firsttemperature adjusting device held in a first rigid substrate, the firstrigid substrate defining a first open region and being fixed to theactuator drive to thereby fix the first gripping apparatus to theactuator drive; the first phase change material is held within the firstopen region and is thermally coupled with the first temperatureadjusting device such that a temperature change in the first temperatureadjusting device causes a temperature change in the first phase changematerial; and the controller is connected to the first temperatureadjusting device of the first gripping apparatus such that the provisionof the signal to the first gripping apparatus controls a temperature ofthe first temperature adjusting device to thereby control a temperatureof the first phase change material.
 16. The positioning apparatus ofclaim 15, wherein: the second gripping apparatus further comprises: asecond temperature adjusting device held in a second rigid substrate,the second rigid substrate defining a second open region and being fixedto the actuator drive to thereby fix the second gripping apparatus tothe actuator drive; the second phase change material is held within thesecond open region and is thermally coupled with the second temperatureadjusting device such that a temperature change in the secondtemperature adjusting device causes a temperature change in the secondphase change material; and the controller is connected to the secondtemperature adjusting device of the second gripping apparatus such thatthe provision of the signal to the second gripping apparatus controls atemperature of the second temperature adjusting device to therebycontrol a temperature of the second phase change material.
 17. Thepositioning apparatus of claim 1, wherein the controller comprises: afirst control module connected to the first gripping apparatus; a secondcontrol module connected to the second gripping apparatus; and anactuator module connected to the actuator drive.
 18. The positioningapparatus of claim 17, wherein: the first control module controls aphase of the first phase change material, wherein the first phase changematerial is either in a solid phase state in which the first phasechange material grips the stick or a liquid phase state in which thefirst phase change material loosens its grip on the stick such that thestick is capable of moving through the first phase change material alongthe axial direction; the second control module controls a phase of thesecond phase change material, wherein the second phase change materialis either in a solid phase state in which the second phase changematerial grips the stick or a liquid phase state in which the secondphase change material loosens its grip on the stick such that the stickis capable of moving through the second phase change material along theaxial direction; and the actuator module controls the relative positionbetween a first end of the actuator drive and a second end of theactuator drive along the axial direction.
 19. The positioning apparatusof claim 18, wherein: the actuator module provides a temporally-varyingsignal to the actuator drive; and a position of the stick along theaxial direction is adjusted by adjusting the one or more signalsprovided to the first gripping apparatus and to the second grippingapparatus.
 20. The positioning apparatus of claim 19, wherein theposition of the stick along the axial direction is adjusted withoutadjusting a signal provided to the actuator drive.
 21. The positioningapparatus of claim 17, wherein: the controller further comprises amaster control module connected to the first control module, the secondcontrol module, and the actuator module; and the master control modulecontrols the signals provided to each of the first control module, thesecond control module, and the actuator module.
 22. The positioningapparatus of claim 1, wherein the second gripping apparatus is thermallyindependent of the first gripping apparatus.
 23. The positioningapparatus of claim 1, wherein the first phase change material and thesecond phase change material include one or more of: wax; paraffin wax;and alkane hydrocarbon.
 24. The positioning apparatus of claim 23,wherein the alkane hydrocarbon includes one or more of: n-octacosane,n-heptacosane, n-hexacosane, n-pentacosane, n-tetracosane, n-docosane,n-tricosane, n-heneicosane, n-eicosane, n-nonadecane, n-octadecane,n-heptadecane, n-hexadecane, n-pentadecane, n-tetradecane, andn-tridecane.
 25. The positioning apparatus of claim 1, wherein the firstphase change material is selected so that the transition between a solidstate and a liquid state occurs at an operating temperature for thefirst gripping apparatus and the second phase change material isselected so that the transition between a solid state and a liquid stateoccurs at an operating temperature for the second gripping apparatus.26. The positioning apparatus of claim 1, wherein the stick extendsthrough the first phase change material and the second phase changematerial.
 27. The positioning apparatus of claim 1, wherein the stick isrigid enough to withstand motion through the first phase change materialand the second phase change material without fracturing or bending orkinking.
 28. The positioning apparatus of claim 1, wherein the stickincludes one or more of: at least one conductor; at least onemeasurement probe; at least one capillary tube; at least one opticalwaveguide; at least one carbon fiber; and at least one sonic waveguide.29. The positioning apparatus of claim 28, wherein the at least onemeasurement probe includes an electrical testing probe, a silicon probe,an electrical recording probe, or an ultrasonic probe.
 30. Thepositioning apparatus of claim 1, wherein first gripping apparatuscomprises a first substrate defining an open region in which the firstphase change material is held and the second gripping apparatuscomprises a second substrate defining an open region in which the secondphase change material is held, the first substrate and the secondsubstrate are each generally defined in a respective x-y plane, and theaxial direction along which the stick is capable of moving is along a zaxis that is perpendicular to the x-y plane.
 31. The positioningapparatus of claim 30, wherein the first substrate and the secondsubstrate each include a printed circuit board.
 32. The positioningapparatus of claim 1, wherein a cross section of the stick taken along aplane is a circular shape, a polygonal shape, or an irregular asymmetricshape.
 33. A method comprising: providing an actuation signal to anactuator drive, wherein the actuation signal controls a movement of theactuator drive along an axial direction; providing a first independentsignal to a first gripping apparatus fixed to a first end of theactuator drive; providing a second independent signal to a secondgripping apparatus fixed to a second end of the actuator drive;controlling a phase of a first phase change material of the firstgripping apparatus by adjusting the first independent signal, the firstphase change material being configured to receive a first region of astick; controlling a phase of a second phase change material of thesecond gripping apparatus by adjusting the second independent signal,the second phase change material being configured to receive a secondregion of the stick; and adjusting or holding constant a position of thestick along the axial direction depending on the provided actuationsignal and the first and second independent signals.
 34. The method ofclaim 33, wherein providing the actuation signal to the actuator drivecomprises controlling a relative movement between the first end of theactuator drive and the second end of the actuator drive along the axialdirection.
 35. The method of claim 33, wherein providing the actuationsignal to the actuator drive comprises providing a temporally-varyingsignal to the actuator drive, the temporally-varying signal controllingan axial position associated with the actuator drive.
 36. The method ofclaim 33, wherein providing the first independent signal to the firstgripping apparatus comprises providing an independent signal to a firsttemperature adjusting device of the first gripping apparatus.
 37. Themethod of claim 36, further comprising selecting a state of a firstphase change material thermally coupled to the first temperatureadjusting device by adjusting the provided independent signal to thefirst temperature adjusting device thermally coupled with that firstphase change material.